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Leader of Digital No Mask Imaging of Advanced 3D Cover-plate

GIS Equpirment high precision exposure directly on 3D glass cover-plate, bringing customers with high-resolution, high-efficiency and high-yield products and stable cooling system to ensure that the interior of the equipment is maintained at constant temperature of 22℃ to guarantee the stability of the equipment. Successfully applies the microfabrication “negative photoresist” process manufacturing technology for integrated circuit to the production of 3D glass cover-plate.
This process manufacturing technology will improve the first yield of 3D glass cover-plate (higher than 95%) with more exquisite patterns and better color restoration. Effectively improve the disadvantages of low yield, high reworking rate, thick thread of silk-screen

Advantages


· high quality pattern transfer to irregular substrate(up to 1um)
· real-time compensation for overlays shrinkage

·high quality pattern transfer to irregular substrate(up to 1um)
·real-time compensation for overlays shrinkage
Capacity Yield Compatibility The cost of proofing
1200 pcs/h ≥95% Compatibility is superior to
all traditional processes
The cost is lower than
All traditional processes

Glass Structure Innovation Trend Compared with Glass Decoration Technology Innovation Trend

Pad Printing Technology)

Directional Light Technology

GIS Laser Direct
Photolithography Technology

GIS Laser Direct
Photolithography Technology

3D Exposure Machine Core Technology

Digital Imaging Technology

Use TI Pattern Generator-DMD chip to produce digital image. DMD is composed of 800,000 or 2,000,000 micromirrors. Square mesh points can be presented clearly and sharply within the scope of DMD light spots. This latest digital exposure system has become a new industry standard.


375 Nanolaser

Industrial-grade 375 nm coupled laser, Independently research-and-developed laser imaging system increases laser utilization of 375 nm coupled laser from traditional 30% to 50%


High Precision Optical Engine

DPL (Digital light processing) optical system uses UV laser light source, The output laser achieves high high uniform illumination of DMD through a special collimating lens, and finally outputs the patterns through projection lens. Projection lens is a double telecentric lens using special ultraviolet optical material with characteristics of low distortion and high transmittance.


High Precision Motion Platform

±1μm motion control system; real-time motion error compensation system


Advanced Intelligent 3D Glass Cover-plate Full Automation Solution

· This solution is used to produce 3D glass cover-plate processing requirements and is suitable for curved-surface glass cover-plate technology;
· With corresponding matching equipment, including full line equipped automatic loading / unloading machine, flat plate / plasma cleaner, automatic spraying machine, tunnel type trunk line, direct writing laser exposure machine, development / washing machine, auxiliary equipment such as tunnel type solid toasting line and vertical oven;
· High resolution, high productivity, high yield, thinner thickness, higher quality (appearance) and low cost;
· Application areas of 3D Glass LDI: wearable products, automotive products, mobile phone products, household appliances industry, etc.

Plasma Cleaning 3D Photoresist Coating Machine GISLaser Exposure Development Bake Imaging
Plasma cleaning uses plasma as a cleaning medium, and uses its high-energy characteristics to decompose impurities on the glass surface. Spray control single
film thickness
3μm±0.05
Tolerance±0.05mm 3D developer conducts partial photoresist stripping on exposed 3D glass product, and finally forms a reserved ink pattern. Vertical oven,
Temperature equalization
was controlled at ±5℃
Finally, a screen cover with
rich colors and various
shapes is formed.
Specifications/model
GL-300
GL-350
Application Area Traditional 2.5D and 3D Cover-plate
Apparent Size mm (can be customized) 2273x1990x1771
Exposure Time CT/pcs 7.5s
Maximum Exposure Area (can be customized) 610x530mm
Acceptable Thickness of Photoresist 1-15Um (conventional 6um)
Nominal Voltage Single Phase 220V/50HZ Good Earthing
Nominal Pressure of Compressed Air 0.8 Mpa
Wavelength of Laser Output 375nm±10nm
Transmission mode of Laser Optical Fiber
Photosensitive Material Photoresist
Image Parsing Resolution 12700dpi
Maximum Power 4KW (Laser 6w ) / 4.5KW (Laser 9w )
Output Laser Power 6W (±3%)/ 9W (±3%)
Input Document Format Gerber274X
Exposure Precision 30±5μm
Precision of Product Multiple Layer
40um
20um
Ink Edge Sawtooth ≤10μm
Dimensional Tolerance of Length and Width in VA Area ±40um
Position Tolerance ≤50um
Hardware Repeatability ±8um

*Specifications subject to change without notice

Look forward to your calls!


GIS Intelligent Inc.


+86 199 5132 0170
+86 (0)512-66579218
mk@www.memoria.cn

Contact Us

GIS Tech Inc.   copyright    鄂ICP備2022014597號(hào)
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